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利扬芯片(688135)
融资融券更新时间:2025-12-12
指标2025-12-122025-12-112025-12-102025-12-092025-12-082025-12-052025-12-042025-12-032025-12-022025-12-012025-11-282025-11-272025-11-262025-11-252025-11-242025-11-212025-11-202025-11-192025-11-182025-11-17
融资余额(万元)19600.0419676.3419997.3520238.3820822.421387.7721451.921482.7921473.8821518.8521642.0821525.3321780.4622693.122749.6322657.4523104.8523460.9923455.5424093.95
融资买入额(万元)1053.74669.08782.91984.311736.291207.211084.261289.381252.331597.492149.513981.843107.172652.022068.19999.35664.721210.131046.911394.55
融资偿还额(万元)1130.04990.091023.941568.332301.661271.331115.151280.471297.31720.722032.764236.964019.822708.561976.011446.751020.871204.671685.321730.64
融券余量(万股)00000000000000000000
融券卖出量(万股)00000000000000000000
融券偿还量(万股)00000000000000000000
融券余额(万元)00000000000000000000
融资融券余额(万元)19600.0419676.3419997.3520238.3820822.421387.7721451.921482.7921473.8821518.8521642.0821525.3321780.4622693.122749.6322657.4523104.8523460.9923455.5424093.95
融资融券差额(万元)19600.0419676.3419997.3520238.3820822.421387.7721451.921482.7921473.8821518.8521642.0821525.3321780.4622693.122749.6322657.4523104.8523460.9923455.5424093.95
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