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天润科技(920564)
融资融券更新时间:2025-10-16
指标2025-10-162025-10-152025-10-142025-10-132025-10-102025-10-092025-09-302025-09-292025-09-262025-09-252025-09-242025-09-232025-09-222025-09-192025-09-182025-09-172025-09-162025-09-152025-09-122025-09-11
融资余额(万元)781.02681.07686739.85779.37691.81555.24586.29560.98742.22894.58783.68783.38779.53820.63574.74728.62669.47656.24650.02
融资买入额(万元)108.54933.0719.02117.96164.855.9842.614.941.66149.7822.6755.71221.43316.4519.6865.0923.2139.133.79
融资偿还额(万元)8.5453.9386.9358.5430.4128.2737.031208.68196.18154.0338.8822.3751.86262.5270.57173.565.939.9832.8851.94
融券余量(万股)00000000000000000000
融券卖出量(万股)00000000000000000000
融券偿还量(万股)00000000000000000000
融券余额(万元)00000000000000000000
融资融券余额(万元)781.02681.07686739.85779.37691.81555.24586.29560.98742.22894.58783.68783.38779.53820.63574.74728.62669.47656.24650.02
融资融券差额(万元)781.02681.07686739.85779.37691.81555.24586.29560.98742.22894.58783.68783.38779.53820.63574.74728.62669.47656.24650.02
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