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惠同新材(833751)
融资融券更新时间:2025-08-04
指标2025-08-042025-08-012025-07-312025-07-302025-07-292025-07-282025-07-252025-07-242025-07-232025-07-222025-07-212025-07-182025-07-172025-07-162025-07-152025-07-142025-07-112025-07-102025-07-092025-07-08
融资余额(万元)2287.222160.142114.422093.992271.522008.281992.822029.552001.1219011465.881449.911519.511526.831530.961506.651608.551444.861475.511514.15
融资买入额(万元)355.43238.74212.87354.15648.66162.41362.87331.17560.32768.86117.3857.2439.5483.01170.2532.3275.14119.1630.7753.9
融资偿还额(万元)228.34193.03192.44531.68385.43146.95399.59302.74460.21333.74101.41126.8546.8587.15145.94134.2111.45149.8269.458.18
融券余量(万股)00000000000000000000
融券卖出量(万股)00000000000000000000
融券偿还量(万股)00000000000000000000
融券余额(万元)00000000000000000000
融资融券余额(万元)2287.222160.142114.422093.992271.522008.281992.822029.552001.1219011465.881449.911519.511526.831530.961506.651608.551444.861475.511514.15
融资融券差额(万元)2287.222160.142114.422093.992271.522008.281992.822029.552001.1219011465.881449.911519.511526.831530.961506.651608.551444.861475.511514.15
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