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正邦科技(002157)
融资融券更新时间：2025-08-04
指标2025-08-042025-08-012025-07-312025-07-302025-07-292025-07-282025-07-252025-07-242025-07-232025-07-222025-07-212025-07-182025-07-172025-07-162025-07-152025-07-142025-07-112025-07-102025-07-092025-07-08
融资余额(万元)67534.265748.1969404.0867452.0666999.7566309.5665747.0565005.3466485.9866293.2266146.6665495.1665203.0664946.3865196.5166608.3366416.8364563.3565819.7164882.91
融资买入额(万元)2984.522540.473594.052701.872607.482385.453013.973162.945338.994680.137281.092754.31560.271717.131766.441751.464311.132361.352753.932162.16
融资偿还额(万元)1198.516196.361642.022249.561917.291822.942272.264643.58-61146.994533.576629.592462.191303.591967.253178.261559.962457.643617.711817.131777.43
融券余量(万股)00000000000000000000
融券卖出量(万股)00000000000000000000
融券偿还量(万股)00000000000000000000
融券余额(万元)00000000000000000000
融资融券余额(万元)67534.265748.1969404.0867452.0666999.7566309.5665747.0565005.3466485.9866293.2266146.6665495.1665203.0664946.3865196.5166608.3366416.8364563.3565819.7164882.91
融资融券差额(万元)67534.265748.1969404.0867452.0666999.7566309.5665747.0565005.3466485.9866293.2266146.6665495.1665203.0664946.3865196.5166608.3366416.8364563.3565819.7164882.91
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